PROBLEM TO BE SOLVED: To reduce the deterioration of the characteristics of a semiconductor device due to the deformation of a connecting part by minimizing the number of connecting parts on a diffusion layer. SOLUTION: The pattern length of a gate line GL formed in the upper layer of a diffusion layer RS of a wafer SI is grasped, and sub-field division is carried out by arranging connecting parts DP1 and DP3 in an NRS outside the region of the diffusion layer RS so that the number of sub-field connecting parts DP2 on the diffusion layer RS can be minimized. COPYRIGHT: (C)2005,JPO&NCIPI