An apparatus and method for bonding a member to a substrate is disclosed. A surface of the member is prepared by applying an element to the surface. The element includes a dye agent that changes color when exposed to a level of plasma radiation consistent with preparing the surface for bonding. The surface is exposed to the plasma radiation and is inspected to see whether or not a change in a color of the dye agent occurs. After the dye agent changes color; the surface is bonded to the substrate.
