A CONTACT PAD AND METHOD OF FORMING A CONTACT PAD FOR AN INTEGRATED CIRCUIT

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专利权人:

XILINX, INC.

发明人:

ZHANG, LEILEI

申请号：

EP20080756746

公开号：

EP2150975(B1)

申请日:

2008.06.05

申请国别(地区):

欧洲专利局

年份:

2016

代理人:

摘要：

A contact pad in an integrated circuit is disclosed. The contact pad comprises a flat portion comprising a base of the contact pad; a plurality of projections extending from and substantially perpendicular to the flat portion; and a solder ball attached to the projections and the flat portion. A method of forming a contact pad is also disclosed.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/