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Surfaces having particles and related methods
专利权人:
Arjun Daniel Srinivas;Alexander Chow Mittal;Priyanka Agarwal;Calvin Peng
发明人:
Arjun Daniel Srinivas,Calvin Peng,Alexander Chow Mittal,Priyanka Agarwal
申请号:
US12601869
公开号:
US08852689B2
申请日:
2008.05.29
申请国别(地区):
US
年份:
2014
代理人:
摘要:
Particles are embedded in a substrate by applying to at least a portion of the substrate a fluid and a population of particles, such that the substrate is softened to at least a degree that particles are at least partially embedded in the softened portion of the substrate. The softened portion of the substrate is hardened so as to securely embed the particles in the substrate.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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