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Carrier package and carrier with plural heat conductors
专利权人:
Viking Tech Corporation
发明人:
Ho Chien-Hung,Lee Chiu-Min,Kuo Chen-Shen
申请号:
US201414461808
公开号:
US9768092(B2)
申请日:
2014.08.18
申请国别(地区):
美国
年份:
2017
代理人:
Davis & Bujold PLLC `Bujold Michael J.
摘要:
A carrier is disclosed, including: a main body having a first surface and a second surface opposing the first surface; a conductive part formed on the first surface of the main body; and a plurality of heat conductors that are not in contact with the conductive part and penetrate the main body to connect the first surface with the second surface. Therefore, heat generated by electronic elements can be effectively dissipated outside to improve the functionality and lifetime of electronic elements.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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