This disclosure describes techniques for measuring the resistance of a component with measurement circuitry that is electrically coupled to the component via one or more electrical conductors (e.g., one or more bond wires). The resistance measurement techniques of this disclosure may measure a resistance of an electrical conductor, and generate a value indicative of a resistance of a component other than the electrical conductor based on the measured resistance of the electrical conductor. The electrical conductor for which the resistance is measured may be the same as or different than one or more of the electrical conductors that the couple the measurement circuitry to the component to be measured. Using an electrical conductor resistance measurement to determine the resistance of a component may improve the accuracy of the resistance measurement for the component.
