A method of incorporating silver and/or copper into a biomedical implant includes: providing an implant having an outer surface； depositing silver and/or copper onto the outer surface of the implant； diffusing the silver and/or copper into a subsurface zone adjacent the outer surface； and oxidizing or anodizing the implant after the diffusion step to form an oxidized or anodized layer that contains at least some amount of elemental silver, elemental copper or silver or copper ions or compounds.
