Disclosed herein are methods for removing spores from skin, the method including dispensing an effective amount of a composition into or onto an article, wherein the composition includes water and from 0.15 wt% to 4 wt% anionic thickener contacting a skin surface with the composition mechanically acting on the skin surface for at least one (1) second while the skin surface is in the presence of the composition and removing at least a portion of the composition from the surface of the skin, wherein removing the composition also removes spores from the skin surface.
