A latch device for heat dissipation component includes a main body, a first and a second elastic member, a first and a second rotary unit. Two sides of the main body are respectively formed with a first and a second perforation. The first and second elastic members are fixedly disposed on one face of a motherboard. A first and a second hook/latch section respectively protrude from the first and the second elastic members corresponding to the first and second perforations. By means of a first and a second hook/latch member, the first and second rotary units are correspondingly hooked/latch with the first and second hook/latch sections. Then, the first and second rotary units are rotated to pull upward the first and second hook/latch members; further the first and second hook/latch sections can fix the main body. Hence, a user can assemble/detach the main body without using any hand tool.
