Via and trench filling using injection molded soldering

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专利权人:

International Business Machines Corporation

发明人:

John U. Knickerbocker,Shriya Kumar,Jae-Woong Nah

申请号：

US15196558

公开号：

US10130302B2

申请日:

2016.06.29

申请国别(地区):

US

年份:

2018

代理人:

摘要：

A method includes forming one or more vias in a substrate, forming at least one liner on at least one sidewall of at least one of the vias, and filling said at least one via with solder material using injection molded soldering. The at least one liner may comprise a solder adhesion layer, a barrier layer, or a combination of a barrier layer and a solder adhesion layer.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/