VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING

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专利权人:

International Business Machines Corporation

发明人:

John U. Knickerbocker,Shriya Kumar,Jae-Woong Nah

申请号：

US16054366

公开号：

US20180344245A1

申请日:

2018.08.03

申请国别(地区):

US

年份:

2018

代理人:

摘要：

An apparatus includes a substrate having one or more vias formed therein. At least one of the vias has at least one liner disposed on at least one sidewall thereof. The apparatus also includes at least one interconnect formed through the at least one via. The one or more interconnects comprise a solder material filled using injection molded soldering.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/