solid-state imaging device (1) includes an imaging device (4) for detecting an object image, a rigid substrate that is electrically connected to the imaging device (4) (5), at least one coaxial line (42 ) have a signal cable (115) having a built-in hard substrate (5) has a first surface having the core wire connection portion the core wire of the coaxial line (42) (42a) is connected to (5a), having an outer conductor connecting portion which the external conductor (42c) is connected to the coaxial line (42) and (5 b), a first surface substantially parallel to the second surface, comprising a coaxial line (42) is rigid are substantially parallel to connect to the first and second surfaces of the substrate (5).固体撮像装置(1)は、被写体像を検出する撮像素子(4)と、撮像素子(4)に電気的に接続した硬質基板(5)と、少なくとも1つ以上の同軸線(42)を内蔵する信号ケーブル(115)と、を有し、硬質基板(5)は、同軸線(42)の芯線(42a)が接続される芯線接続部(5a)を有する第1の面と、同軸線(42)の外部導体(42c)が接続される外部導体接続部(5b)を有し、第1の面と略平行な第2の面と、を備え、同軸線(42)が硬質基板(5)の第1および第2の面に対して略平行に接続されている。
