This laser processing device (1) includes: a mechanism (4G) that processes a workpiece (W) by turning a spot (SP) on the surface of the workpiece (W) irradiated by laser light (LL) and moving the spot (SP) away from the position where irradiation of the laser light (LL) started as turning of the spot (SP) of the laser light (LL) progresses; and a control device (31) that increases, from the start to the end of processing of the workpiece (W), the energy of the laser light (LL) from that used when the processing of the workpiece (W) started.
