PROBLEM TO BE SOLVED: To provide a heat-absorptive cooling mechanism which can sufficiently improve a cooling effect by efficiently conducting heat of an object to be cooled smoothly.SOLUTION: A heat-absorptive cooling mechanism CL includes: a heat conductive member 110 that contacts and supports an object to be cooled from bottom a thermal electronic cooling unit (130) having a thermal electronic cooling element (131) and having a heat-absorptive side which is in contact with a heat conducting member 110 and a heat sink 140 which is in contact with a heat generating side of the thermal electronic cooling unit (130). The heat conductive member 110 includes a contact part 111 which extends in a horizontal direction and which comes into contact with the object to be cooled, and a supporting part 112 which extends downwardly from the contact part 111 so as to form a T-shape. When view from front of the T-shape, a width W1 of an upper part 112a of the supporting part 112 is made larger than a width W2 of a lower part 112b of the supporting part 112.SELECTED DRAWING: Figure 4COPYRIGHT: (C)2019,JPO&INPIT【課題】効率よくスムーズに被冷却物の熱を伝導して冷却効果を十分に高める吸熱式冷却機構を提供する。【解決手段】吸熱式冷却機構CLは、被冷却物に対して下方から接触するとともに支持する伝熱部材110と、熱電子冷却素子(131)を有して吸熱側を伝熱部材110と接触させた熱電子冷却ユニット(130)と、熱電子冷却ユニット(130)の発熱側と接触するヒートシンク140とを備え、伝熱部材110が、水平方向に延設されて被冷却物と接触する接触部111と、接触部111から下方に延設された支持部112とを有してT字状に形成され、T字正面視の支持部112における上方部分112aの幅W1が、支持部112における下方部分112bの幅W2よりも広く形成されている。【選択図】図4
