The invention relates to a method for bonding stacked layers (19, 20) for making printed circuits, by electromagnetic induction.;In particular, a magnetic flux is locally induced at a plurality of conducting spacers (25) provided along a peripheral area (22) of the multilayer stack (18).;By this method, it is possible to induce magnetic fluxes with opposite sign in individual areas of the peripheral area, thus achieving the maximum energy efficiency during the bonding process.;The invention further comprises an induction head and a bonding apparatus for performing the method.
