Molded adhesive wafer

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专利权人:

コンバテック・テクノロジーズ・インコーポレイテッド

发明人:

ケネス・ジョンセン

申请号：

JP2016529761

公开号：

JP6574418B2

申请日:

2014.05.23

申请国别(地区):

JP

年份:

2019

代理人:

摘要：

Disclosed herein are methods and devices for coupling and securing a medical device appliance. In particular, one piece moldable adhesive structures are disclosed which allow customization of an attachment wafer to the size and shape of, for example, a stoma, while allowing flexibility and security for attaching a medical device, such as an ostomy pouch or other device to the subject.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/