Heat-dissipation structure for an indicia reading module

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专利权人:

Hand Held Products, Inc.

发明人:

Feng Chen,Xian Tao,Bremer Edward C.

申请号：

US201615079882

公开号：

US9572284(B2)

申请日:

2016.03.24

申请国别(地区):

美国

年份:

2017

代理人:

Additon, Higgins & Pendleton, P.A.

摘要：

Small mobile computing devices place stringent requirements on the electronic modules integrated within. High temperatures inside these mobile computing devices are unavoidable; therefore good thermal management is important to insure proper module operation. Here a heat-dissipation structure for an indicia-reading module integrated within a mobile computing device is disclosed.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/