HIGH-SPEED HOTSPOT OR DEFECT IMAGING WITH A CHARGED PARTICLE BEAM SYSTEM

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专利权人:

KLA-TENCOR CORPORATION

发明人:

XIAO, Hong,MAHER, Christopher

申请号：

WO2016US34132

公开号：

WO2016191482(A1)

申请日:

2016.05.25

申请国别(地区):

世界知识产权组织国际局

年份:

2016

代理人:

摘要：

An inspection tool includes a controller that is configured to generate a scan pattern for an electron beam to image areas of interest on the wafer. The scan pattern minimizes dwell time of the electron beam on the surface of the wafer between the areas of interest. At least one stage speed and at least one raster pattern can be selected based on the areas of interest. The controller sends instructions to electron beam optics to direct the electron beam at the areas of interest on the surface of the wafer using the scan pattern.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/