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Base polymer for hot melt adhesive
专利权人:
出光興産株式会社
发明人:
鮫島 佳奈子,中島 晴美,南 裕,武部 智明
申请号:
JP2016566411
公开号:
JP6677378B2
申请日:
2015.12.22
申请国别(地区):
JP
年份:
2020
代理人:
摘要:
A base polymer for hot-melt adhesive, containing a propylenic polymer (A) having a tensile modulus of elasticity of 60 MPa or more, and an olefinic polymer (B) having a tensile modulus of elasticity of less than 60 MPa, wherein, relative to 100 parts by mass of the total amount of the propylenic polymer (A) and the olefinic polymer (B), the content of the propylenic polymer (A) is 1 part by mass or more and less than 50 parts by mass, and the content of the olefinic polymer (B) is more than 50 parts by mass and 99 parts by mass or less; and a hot-melt adhesive containing the base polymer, and further containing at least one of (C) a tackifier resin and (D) an oil.
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中国工程科技知识中心
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