The invention relates to a device for materials processing using laser radiation,the device comprising a laser beam source (S), which emits pulsed laser radiation(3) that interacts with the material (5), a lens (6), which focuses the pulsedlaser radiation (3) in the material (5) on a centre of interaction (7), the laserpulses interacting with the material (5) in the associated zones (8) surroundingthe centres of interaction (7) so that material (5) is separated in the interactionzones (8), a scanning device (10), which adjusts the position of the centre ofinteraction in the material (5), and a control device (17), which controls thescanning device (10) and the laser beam source (S) such that a sectioned area (9)is formed in the material (5) by lining up the interaction zones (8), and the controldevice (17) controlling the laser beam source (S) and the scanning device (10)in such a way that adjacent centres of interaction (7) lie at a distance of a ≤10 µm in relation to one another.
