An implantable device, comprising a rigid substrate having an electrically non-conductive portion； a plurality of electrically conductive vias through said electrically non-conductive portion, said vias and electrically non-conductive portion forming said rigid substrate； metal traces on said rigid substrate electrically connected to said conductive vias； a circuit attached to said metal traces； a braze stop trace surrounding said metal traces； a cover bonded to said rigid substrate with a braze, said cover and said rigid substrate forming a hermetic package； wherein said braze stop trace prevents said braze from contacting said metal traces.
