Copper structures with intermetallic coating for integrated circuit chips

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专利权人:

Monolithic Power Systems, Inc.

发明人:

Jiang Hunt Hang

申请号：

US201514944054

公开号：

US9754909(B2)

申请日:

2015.11.17

申请国别(地区):

美国

年份:

2017

代理人:

Okamoto & Benedicto LLP

摘要：

An integrated circuit (IC) chip includes a copper structure with an intermetallic coating on the surface. The IC chip includes a substrate with an integrated circuit. A metal pad electrically connects to the integrated circuit. The copper structure electrically connects to the metal pad. A solder bump is disposed on the copper structure. The surface of the copper structure has a coating of intermetallic. The copper structure can be a redistribution layer and a copper pillar that is disposed on the redistribution layer.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/