Subido Willmar,Co Reynaldo,Zohni Wael,Prabhu Ashok S.
申请号：
US201514796745
公开号：
US9761554(B2)
申请日:
2015.07.10
申请国别(地区):
美国
年份:
2017
代理人:
摘要：
An apparatus, and methods therefor, relates generally to an integrated circuit package. In such an apparatus, a platform substrate has a copper pad. An integrated circuit die is coupled to the platform substrate. A wire bond wire couples a contact of the integrated circuit die and the copper pad. A first end of the wire bond wire is ball bonded with a ball bond for direct contact with an upper surface of the copper pad. A second end of the wire bond wire is stitch bonded with a stitch bond to the contact.
