Toyota Motor Engineering & Manufacturing North America, Inc.
发明人:
Yoon Sang Won,Guo Yuanbo
申请号：
US201414465264
公开号：
US9642285(B2)
申请日:
2014.08.21
申请国别(地区):
美国
年份:
2017
代理人:
Dinsmore & Shohl LLP
摘要：
Power modules and power module arrays are disclosed. In one embodiment, a power module includes a module support, a high temperature module, and a module cap. The module support includes a frame member, a heat spreader, a first electrically conductive rail, and a second electrically conductive rail. The high temperature module includes a module substrate, a semiconductor device thermally and/or electrically coupled to a semiconductor surface of the module substrate, a first external connector, and a second external connector. The first and second electrically conductive rails are disposed within a through-hole of the first and second external connectors, respectively. The module cap includes a body portion, a plurality of posts, a first opening, and a second opening. The plurality of posts presses against at least the first external connector, the second external connector, and the module substrate such that the high temperature module is thermally coupled to the heat spreader.
