Institute of Microelectronics, Chinese Academy of Sciences
发明人:
Zhu Huilong
申请号：
US201514722022
公开号：
US9633855(B2)
申请日:
2015.05.26
申请国别(地区):
美国
年份:
2017
代理人:
Knobbe, Martens, Olson & Bear, LLP
摘要：
Planarization processing methods are disclosed. In one aspect, the method includes patterning a material layer and planarizing the patterned material layer by using sputtering. Due to the patterning of the material layer, the loading requirements of nonuniformity on a substrate for sputtering the material layer are reduced, compared with that before the patterning.
