PACKAGES FOR INTEGRATED CIRCUITS AND METHODS OF PACKAGING INTEGRATED CIRCUITS

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专利权人:

Everspin Technologies, Inc.

发明人:

UGGE ANGELO V.

申请号：

US201615290849

公开号：

US2017104149(A1)

申请日:

2016.10.11

申请国别(地区):

美国

年份:

2017

代理人:

摘要：

An integrated circuit package including an integrated circuit die including a first side and a second side opposite the first side, the first side including at least one magnetoresistive device formed thereon. The integrated circuit package also may include a first magnetic shield disposed on or adjacent the first side of the integrated circuit die, wherein the first magnetic shield is formed of a composite material.

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中国工程科技知识中心

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http://www.ckcest.cn/home/