The endoscope 2 is a semiconductor substrate 11 having an imaging terminal 13 formed on a first main surface 10sa and having a junction terminal 18 on a second main surface 10sb, and a conductive layer 12a disposed on the first principal surface 10sa of the semiconductor substrate 11 with insulating layers 12b and An imaging device 1 having a wiring layer 12, a wiring element 10 having a wiring layer 12, and a cover glass 30 bonded to cover the entire major surface of the first main surface of the imaging device 10 is disposed at the tip end 2a of the insertion part The endoscope 2 is provided with a protective portion 40 in which the cut-off particles 42, which are lower in the moisture permeability of the resin 41, are dispersed in the resin 41 covering at least the side surfaces of the wiring layer 12 of the imaging device 10.内視鏡2は、第1の主面10SAに撮像部13が形成され第2の主面10SBに接合端子18を有する半導体基板11と、前記半導体基板11の前記第1の主面10SAに配設された、導体層12Aが絶縁層12B、12Cを介して積層されている、配線層12と、を有する撮像素子10と、前記撮像素子10の前記第1の主面側の全体を覆うように接着されているカバーガラス30と、を具備する撮像装置1が、挿入部の先端部2aに配設されている内視鏡2であって、少なくとも前記撮像素子10の前記配線層12の側面を覆う、樹脂41に透湿性が前記樹脂41の透湿性よりも低い遮断粒子42が分散されている、保護部40を有する。
