A substrate terminal includes at least one substrate abutting portion configured to be made to abut against a substrate, at least one substrate connection portion configured to be inserted into a hole portion in the substrate and be soldered together with the hole portion with the substrate abutting portion and the substrate abutting against each other, a terminal connection portion to which an opposite-side terminal is inserted in a direction same as an insertion direction of the substrate connection portion into the hole portion and connected, and an intermediate portion configured to connect the substrate abutting portion and the substrate connection portion with the terminal connection portion. A slit is provided between the substrate abutting portion and the substrate connection portion adjacent to each other.
