KIM, Yong Dug,CHO, Kyu Hwan,JUNG, Hyun Taek,LEE, Gyo Jun
申请号：
WO2016KR09942
公开号：
WO2017061703(A1)
申请日:
2016.09.06
申请国别(地区):
世界知识产权组织国际局
年份:
2017
代理人:
摘要：
A laser processing device according to one embodiment of the present invention can comprise: a laser emission unit emitting a laser beam so as to form a processing groove on a wafer; a wafer chuck on which the wafer is loaded, and which moves along a first axial direction; a cam disposed so as to be fixed to the wafer chuck; a cam guide formed to extend along the first axial direction, and making contact with the cam so as to guide a movement path of the wafer chuck; a first slide guide extending along the first axial direction and guiding the movement path of the wafer chuck; and a sensor unit for sensing the movement of the first slide guide in a second axial direction orthogonal to the first axial direction.
