The United States of America as Represented by the Secretary of the Army
发明人:
Chao Nien-Hua,Dispenza John A.,DeAngelis Mario
申请号：
US201514963920
公开号：
US9860992(B1)
申请日:
2015.12.09
申请国别(地区):
美国
年份:
2018
代理人:
DiScala John P.
摘要：
A polymer layering process that encapsulates and protects electronics components with complex and imprecise geometries. The protective layering process provides a combination of a flexible mold and/or a rigid mold that apply close-forming, encapsulating the polymer layers to the electronic components and precision assemblies. Polymer layer protective jackets are shaped to as-populated circuit boards and assemblies, providing tightly fit barriers with fine resolution accommodating imprecise geometries. The protective jackets can be formed in rigid, semi-rigid, or highly flexible polymer films, to protect the circuitry from the elements, CTE mismatches, shock and vibration loads and extreme g-forces.
