CO OR NI AND CU INTEGRATION FOR SMALL AND LARGE FEATURES IN INTEGRATED CIRCUITS

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专利权人:

APPLIED MATERIALS, INC.

发明人:

SHAVIV, Roey,EMESH, Ismail, T.

申请号：

WO2016US62583

公开号：

WO2017119955(A1)

申请日:

2016.11.17

申请国别(地区):

世界知识产权组织国际局

年份:

2017

代理人:

摘要：

In one embodiment of the present disclosure, a method for depositing metal in a feature on a workpiece is provided. The method includes electrochemically depositing a second metal layer on a first metal layer on a workpiece having at least two features of two different sizes in a dielectric layer, wherein the second metal layer is a copper layer and wherein the first metal layer includes a metal selected from the group consisting of cobalt and nickel, wherein the first metal layer completely fills the smallest feature but does not completely fill the largest feature.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/