Circuit substrate, method of manufacturing circuit substrate, and electronic component

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专利权人:

SONY CORPORATION

发明人:

Asami Hiroshi

申请号：

US201314133074

公开号：

US9918388(B2)

申请日:

2013.12.18

申请国别(地区):

美国

年份:

2018

代理人:

Chip Law Group

摘要：

A circuit substrate includes: a mounting region having an exposed surface that is planarized, and in which a predetermined chip is to be mounted; patterns provided in the mounting region, and including respective top faces that form a part of the exposed surface; and solder bumps provided on the respective patterns, and having substantially same shape as one another.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/