Christian S. Nielsen,Rajesh V. Iyer,Gordon O. Munns,Andrew J. Ries,Andrew J. Thom
申请号：
US16171776
公开号：
US20200137910A1
申请日:
2018.10.26
申请国别(地区):
US
年份:
2020
代理人:
摘要：
Various embodiments of a sealed package and a method of forming such package are disclosed. The package includes a housing having an inner surface and an outer surface, a dielectric substrate having a first major surface and a second major surface, and a dielectric bonding ring disposed between the first major surface of the dielectric substrate and the housing, where the dielectric bonding ring is hermetically sealed to both the first major surface of the dielectric substrate and the housing. The package further includes an electronic device disposed on the first major surface of the dielectric substrate, and a power source disposed at least partially within the housing and electrically connected to the electronic device.
