An imaging unit and an endoscope, which enable further downsizing to be realized and are high in reliability, are provided. An imaging unit 40 includes: an imaging chip 43 that generates an image signal by receiving light via a light receiving surface thereof and performing photoelectric conversion； at least one semiconductor chip 44 having a size fitting into a plane of optical axis direction projection of the imaging chip 43, the size being projected onto a plane orthogonal to an optical axis direction； and a reinforcement member 46 that is arranged on at least one side surface of the semiconductor chip 44； the semiconductor chip 44 is layered and mounted on a back side of the light receiving surface of the imaging chip 43； and the reinforcement member 4 is arranged to cover a connection interface between the imaging chip 43 and the semiconductor chip 44, or between the semiconductor chips 44.
