PROBLEM TO BE SOLVED: To provide a photosensitive resin composition that ensures a margin of a pre-drying time and a standing time after pre-drying for a long period of time without degrading hardness of a coating film and solder heat resistance and that can prevent sticking to a negative film after exposure, a production method of a printed wiring board having a cured coating of the photosensitive resin composition, and a production method of a reflection sheet having a cured coating of the photosensitive resin composition.SOLUTION: The production method of a printed wiring board is carried out by using the following photosensitive resin composition. The photosensitive resin composition comprises (A) a carboxyl group-containing photosensitive resin, (B) a crystalline epoxy compound having a melting point of 130°C or higher and 150°C or lower, (C) a solvent, (D) a photopolymerization initiator, and (E) a reactive diluent, wherein the (B) crystalline epoxy compound having a melting point of 130°C or higher
