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ULTRASONIC DEVICE, ULTRASONIC MODULE, AND ULTRASONIC MEASURING APPARATUS
专利权人:
Seiko Epson Corporation
发明人:
Hiromu MIYAZAWA,Hiroshi ITO,Tomoaki NAKAMURA,Masayoshi YAMADA,Kanechika KIYOSE,Tsukasa FUNASAKA
申请号:
US16097113
公开号:
US20190343492A1
申请日:
2017.04.18
申请国别(地区):
US
年份:
2019
代理人:
摘要:
An ultrasonic device includes: a substrate provided with a first opening and a second opening; a support film that is provided on the substrate and blocks the first opening and the second opening; a transmitting piezoelectric film that is provided on the support film at a position which overlaps the first opening when viewed in a thickness direction of the substrate and is interposed between a pair of electrodes in the thickness direction of the substrate; and a receiving piezoelectric film that is provided on the support film at a position which overlaps the second opening when viewed in the thickness direction of the substrate and is interposed between a pair of electrodes in the thickness direction of the substrate. In the thickness direction of the substrate, a thickness dimension of the transmitting piezoelectric film is smaller than a thickness dimension of the receiving piezoelectric film.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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