An example method involves: forming a first bio-compatible layer that defines a first side of a bio-compatible device forming a conductive pattern over a portion of the first bio-compatible layer mounting an electronic component to the electrical contacts forming a second bio-compatible layer over the first bio-compatible layer, the electronic component, the conductive pattern, wherein the second bio-compatible layer defines a second side of the bio-compatible device forming a first etch mask to partially cover the second bio-compatible layer, thereby exposing a first portion of the second bio-compatible layer removing the first portion of the second bio-compatible layer forming a second etch mask to partially cover the second bio-compatible layer, thereby exposing a second portion of the second bio-compatible layer and removing the second portion of the second bio-compatible layer.
