An image pickup apparatus includes a plurality of micro pins provided to project from a back surface in an image pickup device, a plurality of electric boards capable of mounting electric components and having board surfaces provided with through-holes or through-grooves formed to enable the plurality of micro pins to pass through respectively, and solder portions that fix the plurality of micro pins and the plurality of electric boards by soldering in land portions adjacent to the through-holes or the through grooves in a state in which the plurality of electric boards with the plurality of micro pins respectively passed through the through-holes or the through-grooves of the plurality of electric boards are stacked on the back surface of the image pickup device.
