A circuit board device for reducing acoustic noise is provided. The circuit board device includes a substrate, a first capacitor packaging area, a second capacitor packaging area, a first pad, a second pad, a third pad and a fourth pad. The first and second capacitor packaging areas are respectively disposed on a first side and a second side of the substrate in a back-to-back manner. The first and second pads are disposed in the first capacitor packaging area for mounting a first capacitor. The third and fourth pads are disposed in the second capacitor packaging area for mounting a second capacitor, wherein the first and third pads are set back-to-back and electrically connected to each other, and the second and fourth pads are set back-to-back and electrically connected to each other.
