An imaging unit includes: an imaging chip generating an image signal by receiving light via a light receiving surface and performing photoelectric conversion； at least one semiconductor chip having a size fitting into a plane, orthogonal to an optical axis direction, of projection of the imaging chip； a reinforcement member arranged on at least one side of the semiconductor chip； and a cover glass covering the light receiving unit of the imaging chip. The semiconductor chip is layered and mounted on a back of the light receiving surface of the imaging chip, the reinforcement member covers a connection interface between the imaging chip and the semiconductor chip, or a connection interface between the semiconductor chips, and interfaces between the reinforcement member and the imaging chip and the semiconductor chip are positioned in a plane of projection in an optical axis direction the imaging chip or the cover glass.
