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Method for thermal annealing and a semiconductor device formed by the method
专利权人:
INFINEON TECHNOLOGIES AG
发明人:
Engelhardt Manfred
申请号:
US201615068762
公开号:
US9679773(B1)
申请日:
2016.03.14
申请国别(地区):
美国
年份:
2017
代理人:
Viering, Jentschura & Partner mbB
摘要:
According to various embodiments, a method may include: disposing a dopant in a semiconductor region; forming a radiation absorption layer including or formed from at least one allotrope of carbon over at least a portion of the semiconductor region; and activating the dopant at least partially by irradiating the radiation absorption layer at least partially with electromagnetic radiation to heat the semiconductor region at least partially.
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