Keith A. Miesel;Eric H. Bonde;Jeremy W. Burdon;Michael A. Schugt
发明人:
Michael A. Schugt,Keith A. Miesel,Jeremy W. Burdon,Eric H. Bonde
申请号：
US11116804
公开号：
US08118748B2
申请日:
2005.04.28
申请国别(地区):
US
年份:
2012
代理人:
摘要：
Embodiments of the invention provide systems and methods for an implantable capacitive pressure sensor. Some embodiments of the invention include a capacitive pressure sensor capsule comprising a substrate, a conductive plate functionally coupled to the substrate, a conductive diaphragm spaced from the conductive plate and functionally coupled to the substrate, a lid hermetically sealed against the substrate, and pressure sensing circuitry disposed within a volume generally defined by the lid and the substrate. Embodiments of the invention also include a lead provided with an implantable pressure sensor capsule and a method of manufacturing a capacitive pressure sensor capsule.
