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DISPOSITIF MEMS POUR ENSEMBLE IMPLANT
专利权人:
ENDOTRONIX; INC.
发明人:
ZAMAN, MOHAMMAD FAISAL,FONG, JEFFREY,CHEE, JULIAN,PANIAN, TYLER,NAGY, MICHAEL
申请号:
CA3087275
公开号:
CA3087275A1
申请日:
2019.01.18
申请国别(地区):
CA
年份:
2019
代理人:
摘要:
Disclosed is an implant and method of making an implant. The implant having a housing that defines a cavity. The housing includes a sensor comprising a base attached to a diaphragm wherein said base may be positioned within said cavity. The sensor may be a capacitive pressure sensor. The diaphragm may be connected to the housing to hermetically seal said housing. The sensor may include electrical contacts positioned on the diaphragm. The attachment between the base and the diaphragm may define a capacitive gap and at least one discontinuity configured to enhance at least one performance parameter of said implant.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/
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