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PROCESS FOR PRODUCING COMPONENTS WITH PRESSURE-SENSITIVE ADHESIVE, AND COMPONENTS WITH PRESSURE-SENSITIVE ADHESIVE
专利权人:
MELTEC CORPORATION
发明人:
SOMA, Kenji
申请号:
WO2016JP69985
公开号:
WO2017006957(A1)
申请日:
2016.07.06
申请国别(地区):
世界知识产权组织国际局
年份:
2017
代理人:
摘要:
Provided are a process for producing components equipped with a pressure-sensitive adhesive and components equipped with a pressure-sensitive adhesive which are produced by this process, the process comprising a printing step in which a pressure-sensitive adhesive 20 in the state of having no tackiness is applied by printing to at least some of the one surface of a substrate 1 on which components are to be formed, an ultraviolet irradiation step in which after the printing step, the substrate 1 is irradiated with ultraviolet light 2 to make the pressure-sensitive adhesive 20 have tackiness, a release paper application step in which release paper 3 is applied to the one surface of the substrate 1, and a shape pressing step in which the shape of each component is formed by punching. In the process, a pressure-sensitive adhesive is not applied separately to individual components but is adhered in advance to components which are to be punched out of the substrate. Hence, the pressure-sensitive adhesive can be adh
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