The present invention presents a printed circuit board heat dissipation system using a highly conductive heat dissipation pad, the heat dissipation system comprising: one or more electronic components mounted on a printed circuit board; the printed circuit board having formed thereon a conductive pattern providing current paths between the mounted one or more electronic components; and a highly conductive heat dissipation pad discharging heat generated due to the current flowing in the conductive pattern of the printed circuit board.
