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貼付剤
专利权人:
日東電工株式会社
发明人:
播摩 潤,今野 昌克,橋野 亮,沼田 晃
申请号:
JP2008219190
公开号:
JP5285356B2
申请日:
2008.08.28
申请国别(地区):
JP
年份:
2013
代理人:
摘要:
An adhesive patch having a support 10 and an adhesive layer 11 formed on at least one surface of the support 10, wherein the adhesive patch has a peripheral part 22 and a central part 21, the adhesive layer 11 has voids 31, the voids 31 in the adhesive layer 11 are localized in the peripheral part 22, the adhesive layer 11 in the central part 21 is substantially free of voids, and the peripheral part 22 of the adhesive layer 11 preferably contains voids 31 at 2.0 - 100 voids/mm 3 on average. Since time-course changes of adhesive layer components such as additive and the like are reduced, the adhesive patch is highly resistant to the detachment from the skin surface, the adhesive layer components do not easily protrude from the edge of the adhesive patch during preservation in a package, adhesion of the adhesive patch to an inner surface of the package is suppressed, the adhesive patch can be easily taken out from the package, and edge lifting of the adhesive patch caused by cold flow is suppressed during adhesion to the skin.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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