An ostomy appliance wafer is provided with a stoma-receiving hole formed through the wafer. The wafer includes a backing layer, and an absorbent layer located between a first adhesive and a second adhesive. The first adhesive is disposed over the backing layer to define a peripheral edge area, a central area surrounding the hole, and an intermediate area of the wafer that is located between the peripheral edge area and the central area. The absorbent layer is disposed on the first adhesive either in A) the central area of the wafer, B) the intermediate area of the wafer, or C) the central area and the intermediate area of the wafer. The second adhesive is disposed over both a portion of an outer edge area of the absorbent layer and a portion of the first adhesive peripheral to the outer edge area of the absorbent layer.
