PROBLEM TO BE SOLVED: To provide a carrier tape easy to be produced, excellent in durability, capable of being manufactured by a mold, and further capable of stably containing a semiconductor package, such as aμBGA(ball grid array), without contact of electrodes. SOLUTION: In a carrier tape 1 in which a large number of containing recesses 2, each being capable of containing a semiconductor package S, are formed at predetermined intervals in the longitudinal direction of the carrier tape 1, a shelf 21 capable of setting a peripheral portion of a bottom face of the semiconductor package S is formed at four corners of the containing recess 2 in such a way that an area surrounded by the shelves 21 is made sizable by expanding it in a planar direction so as to become wider than an opening of the containing recess 2. Side walls of the containing recess 2 at four sides among these shelves 21 are formed as positioning portions 22 enabling mutually opposed intervals to position the semiconductor package S in a planar direction.
