Insulating film, printed circuit board using the same, and method of manufacturing the printed circuit board

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专利权人:

Samsung Electro-Mechanics Co., Ltd.

发明人:

Kang Dong Hun,Lee Joung Suk

申请号：

US201514699808

公开号：

US9775253(B2)

申请日:

2015.04.29

申请国别(地区):

美国

年份:

2017

代理人:

NSIP Law

摘要：

There are provided an insulating film, a printed circuit board including the insulating film, and a method of manufacturing the printed circuit board. The insulating film includes a first insulating material; a second insulating material; and a metal thin film disposed between the first insulating material and the second insulating material.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/