您的位置: 首页 > 农业专利 > 详情页

Circuit module having surface-mount pads on a lateral surface for connecting with a circuit board
专利权人:
CYNTEC CO., LTD.
发明人:
Lu Bau-Ru
申请号:
US201514614401
公开号:
US9668359(B2)
申请日:
2015.02.04
申请国别(地区):
美国
年份:
2017
代理人:
Teng Min-Lee`Litron Patent & Trademark Office
摘要:
A circuit module for connecting to a circuit board is disclosed, the circuit module for connecting to a circuit board, wherein the circuit module comprises a substrate having a top surface, a bottom surface and a lateral surface connecting the top surface and bottom surface, wherein at least one electrical component is disposed on the top or bottom surface and a plurality of surface-mount pads are disposed on the lateral surface of the substrate for electrically connecting to corresponding pads on the circuit board.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

意 见 箱

匿名:登录

个人用户登录

找回密码

第三方账号登录

忘记密码

个人用户注册

必须为有效邮箱
6~16位数字与字母组合
6~16位数字与字母组合
请输入正确的手机号码

信息补充